Porous Nanocomposites for Electromagnetic Interference Shielding 1st Edition

Capture the next wave of materials innovation with Porous Nanocomposites for Electromagnetic Interference Shielding, 1st Edition by Sabu Thomas, Claudio Paoloni, and Avinash R. Pai. This authoritative volume delivers a clear, modern roadmap for designing lightweight, high-performance EMI shielding solutions—essential reading for researchers, engineers and product developers confronting electromagnetic pollution in an increasingly connected world.

Explore cutting-edge chapters that blend theory and practice: tailored porous architectures, conductive fillers, hybrid nanostructures, fabrication techniques, and advanced characterization methods. Real-world examples highlight applications across aerospace, automotive, telecommunications (including 5G/IoT), defense and consumer electronics, with attention to material performance, thermal stability and mechanical integrity.

Why this book matters: porous nanocomposites offer superior absorption, broadband shielding and reduced weight compared with traditional metal enclosures. The authors synthesize multidisciplinary insights—materials science, polymer engineering and electromagnetic theory—into actionable guidance for laboratory research, scale-up and industrial adoption. Comprehensive figures, comparative data and design principles help translate laboratory findings into market-ready solutions.

Perfect for academics, R&D teams and industry professionals across Europe, North America, Asia-Pacific and beyond, this edition positions you to meet regulatory demands and competitive pressures in global electronics and manufacturing markets. If you’re developing next-generation EMI shielding that balances performance, cost and manufacturability, this book is an indispensable reference.

Secure your copy today and equip your lab or team with the knowledge to accelerate innovation in porous nanocomposite EMI shielding.

Note: eBooks do not include supplementary materials such as CDs, access codes, etc.